This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plasfic Encapsulafed Microcircuifs and Semiconducfors in Milifary, Aerospace and Ofher Rugged Applicafions (the latest revision).

The scope of this document is to establish the recommended minimum qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in many rugged, military, severe, or other environments.

Background

The authors of this bulletin had considered two approaches when developing this document in response to this trend:

1. Seeking consensus between OEMs of what qualification and monitoring tests should be performed.

2. Reviewing the standard process flows of "best in class" or otherwise "mainstream" device manufacturers and compiling a common set of tests.

The authors chose the latter.

By choosing the second approach and defining a core group of tests that the majority of "best in class" suppliers use, OEMs can tap into these cost effective standard products while still obtaining the desired performance that satisfies OEM needs.

Purpose

The purpose of this document is to provide guidance to OEMs in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for many of the equipment applications described above.

Device manufacturers may use this document as a guide to develop process flows to produce standard product for the above environments. "Best In Class" suppliers can easily meet these criteria and can readily supply the necessary data to demonstrate compliance.

This document is not intended for use as a guide for "uprating" or "upscreening" devices.

It is not the intent of this document to impose requirements on device manufacturers. Nor is the intent to define specific requirements for any given device application.

The user of this document must determine the suitability of this guideline for a specific application.