This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task.

This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term "Rework/Repair" is used as applicable.

NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

Customers who purchased TECHAMERICA GEIA-HB-0005-3
also purchased

• TECHAMERICA GEIA-HB-0005-1 : Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics
• TECHAMERICA GEIA-STD-0005-1-A : Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
• TECHAMERICA GEIA-STD-0005-3 : Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes
• TECHAMERICA GEIA-HB-0005-2 : Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and F inishes

See More Documents