This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance.

Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection while crucial, may not be sufficient to identify Pb-free piece parts.

Note: Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations. The industry conversion to Pbfree solder technology may affect an aerospace program in one or both of the following ways:

1. If the program is required to implement Pb-free technology (contract requirement, environmental regulation, etc), then the program manager/lead systems engineer will need to assess the impact of in-house transition with respect to design (performance of products using Pb-free) and process (processes to build Pb-free products).

2. If the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very good chance that these items will contain Pbfree solder or Pb-free finishes on parts, printed wiring boards (PWBs), or CCAs.

The basic principles delineated in this handbook can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The appendices in the document describe tools that can be used in conjunction with this handbook.

(1) Appendix A describes a matrix of product tier level versus associated risks with respect to a Pb-free transition.

(2) Appendix B contains links to the European Union Directives and Executive Order 13148.

(3) Appendix C contains a General Program Manager Checklist for Dealing with Pb-free Issues that summarizes the content of the GEIA-HB-0005-1 (this handbook).

(4) Appendix D contains a General Manufacturing Process Assessment Checklist to assess supplier compliance to GEIA-STD-0005-1.

(5) Appendix E describes recommended program language to assure performance, reliability, airworthiness, safety, and certifiability of Pb-free product(s).

This handbook is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with GEIA-STD-0005-1, "Performance Standard for Aerospace Electronic Systems Containing Lead-free Solder". Please note that the program manager and systems engineer (along with their respective organizations), and the appropriate enterprise authority work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. Herein " program management (or manager) and/or systems engineering management (or manager) and/or the appropriate enterprise authority" shall be defined as "program manager" throughout the remaining document (see Section 3, Terms and Definitions).

Customers who purchased TECHAMERICA GEIA-HB-0005-1
also purchased

• TECHAMERICA GEIA-STD-0005-1-A : Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
• TECHAMERICA GEIA-STD-0005-2 REV A : Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems
• TECHAMERICA GEIA-HB-0005-2 : Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and F inishes
• TECHAMERICA GEIA-STD-0005-3 : Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes

See More Documents