This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

Test methods can be applied to several types of ball grid array packages such as FCBGA, PBGA, CBGA, and CCGA with minimum 0.5 mm ball-to-ball pitch and constructed with leaded and lead-free solder alloys.

Guidelines for pre-SMT voids may not be sufficiently robust where ball grid array packages balls are assembled onto unfilled micro-via structures on package substrate land. Hence, the un-filled microvia construction is considered out-of-scope for this document, while filled via is within scope.