The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides the OVERVIEW;

Each group will have one or more applicable documents to reflect different thermal measurement requirements. Because environmental conditions, component mounting approaches and device construction techniques and processes will change as technology changes, additional documents will be added to these groups as the needs arise and standards established. As appropriate, each of these documents will contain terminology and symbolic definitions that are specific to the material covered by the individual document; this information will also be included in a single document to make for easy access.