JEDEC JESD51-3
JEDEC JESD51-3 1996-AUG-01 Low Effectve Thermal Conductvty Test Board for Leaded Surface Mount Packages
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This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements, minimum trace lenghts, trace thickness, and routing considerations. Application includes still air and moving air thermal tests.