JEDEC JESD51-4
JEDEC JESD51-4 1997-FEB-01 Thermal Test Chp Gudelne Wre Bond Type Chp-Errata - September 1997 Replaces JEP129 1997
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This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.