JEDEC JESD22-B109A
JEDEC JESD22-B109A 2009-JAN-01 Flp Chp Tensle Pull
Cart
(empty)
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.