This guideline provides terms and definitions for "low-halogen" solid state devices and recommends methods for marking and labeling. This document may be applied to all nonmetallic and nonceramic materials of solid state devices. Examples of solid state devices include transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g., multichip, hybrid), and memory modules (e.g., DIMM, SIMM). Examples of electronic devices that are not covered by this publication include printed circuit boards, cables, connectors, passive components, assemblies, and electronic products.

This guideline establishes the maximum concentration level for the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC. While the halogen group contains fluorine, chlorine, bromine, iodine, and astatine, this guideline will use the term "low-halogen" to refer only to bromine and chlorine. The definition of "low-halogen" is different from the term "halogen-free" as described in IEC 61249-2 sectional standard related to nonhalogenated base material and as defined in the J-STD-609 marking and labeling standard; standards that pertain only to printed boards and are currently in use in the electronics and solid state industries.

BFRs, CFRs, and PVC in materials that may be used during processing, in product delivery systems, or in packaging, but do not remain within the final product are not included in the scope of this guideline.