This standard covers requirements for punched and embossed carrier taping of components such as silicon dies, bumped flip chip devices, and chip scale packages. Refer to EIA 48 1-1 for current industry standard for 8 mm and 12 mm taping of surface mount components.

Customers who purchased EIA EIA-763
also purchased

• ECA EIA-481-D : 8 mm THROUGH 200 mm EMBOSSED CARRIER TAPING AND 8 mm jsessionid=uRnJBStqng4L+Z00SRy52w**.app2?event=DOCUMENT_DETAILSreturn true" onMouseout="window.status=' ';return true">ECA EIA-726 : 8 mm Punched jsessionid=uRnJBStqng4L+Z00SRy52w**.app2?event=DOCUMENT_DETAILSreturn true" onMouseout="window.status=' ';return true">EIA EIA-541 : Packaging Material Standards for ESD Sensitive Items

See More Documents