Soldering of SMT components is performed, in general, at a relatively low soldering temperature (215°C). Thus, the reflow characteristics of the finish must be carefully considered. In addition, the solder joint itself is less forgiving to marginal conditions which may exist relative to solder joint strength, fillet size, pad/lead size ratios, etc. Thus finish compatibility is of prime importance. This document is a guide in establishing finishes for SMT terminations.