This procedure establishes the test procedures for determining temperature rise versus current for connectors and sockets with conductor sizes equal to or less than 0000 AWG or equivalent.

Test methods

Method 1, specified current

The object of this test is to determine the temperature rise of connectors/sockets carrying a specified current; see 4.2.

Method 2, temperature rise versus current curve

The object of this test is to establish a characteristic temperature rise versus current curve for the connector or socket: see 4.3. This curve may subsequently be used to create a derating curve as appropriate for the stated maximum operating temperature of the connector or socket.

Method 3, specified temperature rise

The object of this test is to determine the current level, that will not exceed a specified temperature rise; see 4.3.

Method 4, inaccessible contacts (TBD)

The object of this test is to determine the temperature rise and/or current derating curve when a group of signal contacts are energized in connectors or sockets with multiple rows (3 or more) and where size and access to the contacts is not practical; see 4.5.