ECA EIA-540HA00
ECA EA-540HA00 2000-MAY-01 Blank Detal Specfcaton for Burn-n Sockets Used wth Ball Grd Array Devces for Use n Electronc Equpment
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The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification shall have:
— Maximum enclosure (maximum length, width and height dimensions).
— A working voltage not exceeding___ volts (rms).
— Current not exceeding __ ampere per pin.