The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure dimensions (See Figure 1.)

b) Working voltage not to exceed ____volts (mis).

c) Current not to exceed ____amperes per pin.

OBJECT

The object of this Detail Specification is to provide all information required for, using Sectional Specification Eh-540F000 as a base, for the identification and quality assessment of Multi- Package Module sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.