The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have:

— Maximum enclosure dimensions as shown in figure 2.

— A working voltage not exceeding 250 volts (rms).

— Current rating not exceeding 1 ampere per pin.

Object

The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.