The European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged seminconductor die. This specification also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die. ES 59008-5-2 specifies particular requirements and recommendations for bare die with contained structures, such as bumped, flip-chip or TAB mounted die including TCP (Tape Carrier Package), that are not contained elsewhere in this series of specifications. Bumped die in wafer form, sawn or unsawn, are included in this part with the exception of information that is common to die without connection structures that is contained in ES 59008-5-1. This specification is for use by semiconductor manufacturers, suppliers, die processors and users of semiconductor die. ES 59008-5-2 is to be read in conjunction with ES 59008-1, General requirements, and ES 59008-3, Mechanical, material and connectivity requirements, and where relevant, ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.