DS DS/EN 61188-5-4
DS DSEN 61188-5-4 2007-DEC-05 Prnted boards and prnted board assembles - Desgn and use - Part 5-4 Attachment landjont consderatons - Components wth J leads on two sdes
DS DSEN 61188-5-4 2007-DEC-05 Prnted boards and prnted board assembles - Desgn and use - Part 5-4 Attachment landjont consderatons - Components wth J leads on two sdes
This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.