This part of IEC 61188 provides information on land pattern geometrics used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficiant area for the appropriate solder fillet, and also allow for inspection, testing and reworking of resulting solder joints. Each clause contains a specific set of criteria, setting out of details on the component, the component dimension, the solder joint design and the land pattern dimensions.