This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of the test conditions, is considered destructive and is only recommended for qualification testing. This standard is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.