The purpose of this part of IEC 60749 is to test and verify that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test should be considered non-destructive. Electrical or mechanical rejects may be used for the purpose of this test.