DS DS/EN 60749-16
DS DSEN 60749-16 2003-JUN-06 Semconductor devces - Mechancal and clmatc test methods - Part 16 Partcle mpact noce detecton PND
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The purpose of this part of IEC 60749 is to detect the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).