DS DSEN 60191-6-2Corr1 2003-MAR-27 Mechancal standardzaton of semconductor devces - Part 6-2 General rules for the preparaton of outlne drawngs of surface mounted semconductor devce packages - Desgn gude for 150 mm 127 mm and 100 mm ptch ball and column termnal packages
This part of IEC 60191 covers the requirements for the preparation of drawings of intergrated circuit outlines for the various ball terminal packages, i.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, i.g. ceramic column grid array (C-CGA).
