Purpose: ARINC Specification 650 defines the packaging details for Integrated Modular Avionics (IMA). It is intended to take full advantage of technical advancements in electronics equipment packaging and provide improved mechanical, electrical and environmental interface techniques for the installation of avionics equipment. These include advances in semiconductor technology which may result in significant space and weight savings to the aircraft with further advantages from the development of standard modules. Airlines have expressed the desire for new packaging concepts which take full advantage of current technology. The packaging concepts of ARINC Specification 650 are expected to simplify the development, acquisition, installation and maintenance of avionics, compared to earlier systems and equipment generations.

To reduce the cost of ownership, weight and volume of new hardware installed in airplanes, avionics system architectures have been developed and are described by ARINC Report 651, "Design Guidance for Integrated Modular Avionics". For these to be totally effective, new standards for hardware packaging have been developed in this Specification. This packaging Specification defines Line Replaceable Modules (LRM) that are installed in operational transport aircraft.

This Specification is intended to be the predominate standard used for future avionics hardware. It does not, however, supersede ARINC Specifications 404A and 600.

Customers who purchased ARINC 650
also purchased

• ARINC 651-1 : Design Guidance for Integrated Modular Avionics-1991; Includes Supplement 1
• ARINC 610-1 : Guidance for Design and Integration of Aircraft Avionics Equipment in Simulators-1986; Includes Supplement 1
• ARINC 638 : Upper Layer Specifications (End System Communication Specifications)
• ARINC 652 : Guidance for Avionics Software Management

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