This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:
. tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
. tin-antimony;
. tin-bismuth;
. tin-copper, with and without silver;
. tin-indium, with and without silver and bismuth;
. tin-silver, with and without copper and bismuth;
. tin-zinc, with and without bismuth.
It also includes an indication of the forms generally available.