DS DS/EN 60191-6-19
DS DSEN 60191-6-19 2010-JUN-14 Mechancal standardzaton of semconductor devces - Part 6-19 Measurement methods of the package warpage at elevated temperature and the maxmum permssble warpage
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IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.