DS DSEN 60191-6-5 2002-APR-08 Mechancal standardzaton of semconductor devces - Part 6-5 General rules for the preparaton of outlne drawngs of surface mounted semconductor devce packages - Desgn gude for fne-ptch ball grd array FBGA
This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
