DS DS/EN 60068-2-54
DS DSEN 60068-2-54 2006-SEP-12 Envronmental testng - Part 2-54 Tests - Test Ta Solderablty testng of electronc components by the wettng balance method
DS DSEN 60068-2-54 2006-SEP-12 Envronmental testng - Part 2-54 Tests - Test Ta Solderablty testng of electronc components by the wettng balance method
This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), 60068-2-69 should be applied if it is suitable.
This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.