This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates, materials, assembly, and test methods as well as established semiconductor fabrication and bumping processes.

Purpose

The purpose is to provide flip chip design standards which are commensurate with established fabrication, bump, test, assembly, handling and application practices. Addressed are electrical, thermal, and mechanical chip design parameters and methodologies as well as the reliability associated with these items. These standards are intended for new designs as well as modifications of non-flip chip designs.

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