This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision was also worked upon for another 3 years by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007.