INTRODUCTION

Chlorofluorocarbon (CFC) compounds have been identified as agents contributing to the reduction of stratospheric ozone. In 1986, many nations of the world signed and ratified the Montreal Protocol, which specified the phase out of CFC production. Since 1986, the Protocol has been amended to accelerate the phase out of these materials. In 1990, the United States Congress incorporated the elements of the Montreal Protocol into the Clean Air Act of 1990, which further accelerated the phase out, with CFC production being halted December 31, 1995. The conversion of the electronics industry to CFC afternative materials and processes has been ongoing during this period.

In 1988, foreseeing the tremendous efforts required to change to CFC alternatives, the ad hoc Solvents Working Group (AHSWG) was formed by Dr. Stephen Andersen of the EPA. The AHSWG was comprised of: Department of Defense (DoD) representatives, military defense contractors, commercial manufacturers, material suppliers, equipment manufacturers, the Institute for Interconnecting and Packaging Electronic Circuits (IPC), and the Environmental Protection Agency (EPA). The goal of the AHSWG was to assist the transition efforts by investigating and characterizing CFC-alternative materials and processes.

This characterization effort was formalized as the Cleaning and Cleanliness Test Program, which was coordinated by the IPC. This Program was divided into three efforts, designated Phase 1, Phase 2, and Phase 3, and are summarized below.