Objective

The Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards had the following objectives:

• Evaluate the performance of small diameter PTHs under controlled environmental conditlons.

• Evaluate the influence of the thickness and quality of deposited copper on PTH performance.

• Determlne the impact of varying PTH aspect ratios.

• Collect data on the influence of product design or manufacturing methods.

• Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.