IPC TR-486
PC TR-486 2001-JUL-01 Report on Round Robn Study to Correlate nterconnect Stress Test ST wth Thermal StressMcrosectonng Evaluatons for Detectng the Presence of nner-Layer Seperatons
PC TR-486 2001-JUL-01 Report on Round Robn Study to Correlate nterconnect Stress Test ST wth Thermal StressMcrosectonng Evaluatons for Detectng the Presence of nner-Layer Seperatons
The scope of this test program includes a study of the repeatability and reproducibility of IST and thermal stress test method to determine the presence of inner-layer separations, development of guidelines for the use of IST testing and test data as a substitute for thermal stress testing in acceptance of product for shipment and to generate a report assessing all pertinent criteria of the program purpose.