The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes, on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.