IPC TR-465-3
PC TR-465-3 1996-JUL-01 Evaluaton of Steam Agng on Alternatve Fnshes Round Robn Test Program Phase A
PC TR-465-3 1996-JUL-01 Evaluaton of Steam Agng on Alternatve Fnshes Round Robn Test Program Phase A
The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many studies have been performed by various industry representatives. This round robin capitalizes on this work to help establish correlations between various testers in order to verify the effect of steam aging on solderability and explore test repeatability and reproducibility.