This specification covers the materials, qualification, certification, and performance requirements for multilayer Polymer Thick Film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator, and through-hole technology. Printed, extrusion deposited, or otherwise applied circuitry, shall meet all applicable requirements of this specification and the master drawing. Etched and plated conventional printed circuits may also be an integral part of this technology. This specification may also be used for procurement of single-sided and double-sided boards. See Figures 1, 2, and 3.