This document prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. This document describes material tests that generate portable data for: (1) direct comparison of different alloys, (2) aiding in alloy acceptability determination for various applications, (3) development of reliability models, and (4) other uses.

Purpose This standard defines the characteristics of solder alloys through the definitions of properties and specification of test methods. These requirements for solder alloys are defined in general terms of material properties. In practice, where more stringent requirements are necessary, additional requirements shall be defined by mutual agreement between the user and supplier. Users are cautioned to perform other tests (beyond the scope of this specification) to fully determine the acceptability of solder alloys for specific purposes.