IPC SM-785
PC SM-785 1992-NOV-01 Gudelnes for Accelerated Relablty Testng of Surface Mount Solder Attachments
Cart
(empty)
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues.