IPC J-STD-005 CHINESE
PC J-STD-005 CHNESE 1995-JAN-01 Requrements for Solderng Pastes-ncorporates Amendment 1 June 1996
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This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.