This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ‘‘special'' electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.

This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are:

IPC/EIA J-STD-004 Requirements for Soldering Fluxes

IPC/EIA J-STD-005 Requirements for Soldering Pastes

Additionally, marking requirements for lead-free materials and assemblies is addressed in this document by direct application of text from IPC/JEDEC J-STD-609, Lead- Free and Leaded Marking, Symbols and Labels (see 6.5).