This standard outlines worst case industry solder (SnPb and Pb-free) assembly process limits for nonsemiconductor electronic components (hereafter referred to as ‘‘components'') along with commodity specific exceptions to the worst case solder assembly process limits. The solder assembly process limits listed in this document represent common industry limits of a given component or component family and are not recommended process parameters for an assembler. An individual Supplier's component capability may be better or worse than the common industry limits documented in this specification. An assembler needs to take into account many factors when establishing a safe assembly process for a given electronic assembly. This standard outlines a process to classify and label a non-semiconductor component's Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry's classification levels (J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This specification does not establish re-work conditions.

Customers who purchased IPC IPC/JEDEC J-STD-075
also purchased

• ECA J-STD-001C : Requirements for Soldered Electrical and Electronic Assemblies
• IPC J-STD-006B : Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications-Incorporates Amendment 1: October 2008; Amendment 2: October 2009

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