IPC IPC/JPCA-6801
PC PCJPCA-6801 2000-JAN-01 Terms and Defntons Test Methods and Desgn Examples for Buld-UpHgh Densty nterconnect HD Prnted Wrng Boards
PC PCJPCA-6801 2000-JAN-01 Terms and Defntons Test Methods and Desgn Examples for Buld-UpHgh Densty nterconnect HD Prnted Wrng Boards
This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred to herein, is defined as the printed board that is built up progressively with the conductor layers and insulating layers using techniques such as plating and printing. The build-up/HDI PWBs include substrates for semiconductor packages.
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