This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged.

This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents.

Note: This document does not address the increased temperature requirements of lead-free solders.