This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types are addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word ‘‘BGA'' can mean all types and forms of ball/column grid array packages.

Purpose

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic assembly, inspection, and repair processes. The intent is to provide useful and practical information to those who are using BGAs, those who are considering BGA implementation and companies who are in the process of transition from the standard tin/lead reflow processes to those that use lead-free materials in the assembly of BGA type components.