IPC 2225
PC 2225 1998-MAY-01 Sectonal Desgn Standard for Organc Multchp Modules MCM-L and MCM-L Assembles
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This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.