This standard establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials: the interconnections may be single, double, or multilayered.

Purpose

The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with PC-2221 (see 1.2) to produce detailed designs intended to mount and attach passive and active components.

The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to perform the physical, thermal, environmental, and electronic functions.

Documentation Hierarchy

Document hierarchy shall be in accordance with the generic standard IPC-2221.

Presentation

Presentation shall be in accordance with the generic standard IPC-2221.

Interpretation

Interpretation shall be in accordance with the generic standard IPC-2221.

Classification of Products

Classification of Products shall be in accordance with the generic standard IPC-2221 and as follows:

Board Types

Board types are classified as:

Type 1 - Single-sided printed board

Type 2 - Double-sided printed board

Type 3 - Multilayer board without blind or buried vias

Type 4 - Multilayer board with blind and/or buried bias

Type 5 - Multilayer metal core board without blind or buried vias

Type 6 - Multilayer metal core board with blind and/or buried vias