This standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid.

Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits.