SAE AMS3731/7B
SAE AMS37317B 1993-JAN-01 Pottng Compound Epoxy Bsphenol A-Type Flled Room Temperature Cure Low Shrnkage
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Form: This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
Application: Primarily for use as a potting or sealing material where low shrinkage is desired.