Form: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175 - 195. When properly mixed and cured, these resins produce a rigid or flexible product.

Application: Primarily for cast shapes; for encapsulation of electronic parts, transformers, coils, and conductors; and for sealing.

Safety - Hazardous Materials: While the materials, methods, applications and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.

Classification: The resin system shall be classified by application and processing criteria as shown in each detail specification.