Form:

This specification covers a high-temperature, electrical grade, polyimide resin adhesive in the form of film or paste.

Application:

This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range −55 to +315 °C (−67 to +600 °F).

Safety - Hazardous Materials:

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.

CAUTION:

These materials may contain an arsenic compound. Ingestion, contact with skin, and inhalation of vapors should be avoided. Handle only with rubber or plastic gloves. Bonding operations should be carried out in vacuum bags with exhaust vented away from working areas.