Form:

This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.

Application:

This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 °C (500 °F), but usage is not limited to such applications.

Safety-Hazardous Materials:

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.